Fig. 3: The full process integration of a DRAM cell array: (a) The whole structure up to the capacitor top TiN deposition, (b) a top-down view to define the desired cross-section, (c) a zoomed view of ...

On the other hand, the microprocessing technology of existing DRAM is limited," said Lee. But in the coming years, Lee predicts "new innovations are expected to occur in the structure of cells." ...

NEO Semiconductor’s 3D X-DRAM™ is a first-of-its-kind 3D NAND-like DRAM cell array structure based on floating body cell technology. It can be manufactured using today’s mature 3D NAND-like process.

SSTL_18/ SSTL_2/ LPDDR/ LVTTL COMBO interface for DRAM application;; 2).Suppport ONFI3.1/Toggle2.0 interface;; 3).SMIC 55nm Logic Low Leakage Salicide 1.2V/1.8V/2.5V ...