A low-noise chip-scale atomic clock (LN-CSAC), the SA65-LN from Microchip, features a profile height of less than 0.5 in. (12.7 Continue Reading ...

"A better end-of-life story." Revolutionary new tech solves major issue of a top packaging material: 'Companies and consumers can get all the benefits' first appeared on The Cool Down.

The term “advanced packaging” includes various technologies, such as “antenna in package” (AiP), heterogeneous integration (e.g., by means of chiplets), or the integration of optical components. These ...

A joint study conducted by UPM Raflatac and Corning Pharmaceutical Technologies has revealed the sustainability and ...

The facility, located within the chipmaker’s expansive Malta campus, will aid the company’s plans to create a U.S.-based, end ...

The U.S. can learn from the Chinese model. Strategic education, technology and infrastructure alignment will be critical to ...

Equator Design’s Aaron Funke explains how packaging must evolve to reflect new ideas around premium products in the pet food ...