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Tom's Hardware on MSN3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per moduleNEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...
In a bold leap forward for semiconductor technology, Cognichip has launched out of stealth with $33 million in seed funding ...
NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the ...
The Nature Communication article details the process in which the QUT researchers, guided by advanced computational design, synthesised a flexible AgCu(Te, Se, S) semiconductor through a simple ...
Synopsys reported solid adoption metrics for their AI tools, as a U.S. memory company reported a 2x improvement in hardware ...
T1C and 3T0C designs combine performance of DRAM with manufacturability of NAND, enabling cost-effective, high-yield ...
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