This is similar to the low power mobile DRAM as the one we found in the iPhone 6s. Looking at the X-rays we see the four dies are not stacked, but are spread out across the package.

Starting in 2016, with the Apple A10 APE in the Apple iPhone 7, TSMC has brought a breakthrough fan-out technology called integrated Fan-Out (inFO) packaging to the market.

Next year's iPhone 18 will use TSMC's next-generation 2-nanometer fabrication process in combination with an advanced new packaging ...

Apple A10 processor used in the iPhone 7. (Credit: Apple) The iPhone 7's new A10 processor is so fast that Intel's newer PC processors are having trouble staying ahead, says a respected chip ...

Apple's A10 Fusion processor found in the new iPhone 7 family is a quad-core chip, but not one like Apple's ever used in any device its ever made before.

When it comes to multi-core scores, the iPhone 7 Plus raked in 5,495, which is a major improvement on the 4,404 scored by the iPhone 6s Plus. The Galaxy Note 7's Exynos 8890 and Snapdragon 820 ...

With next year's anticipated "A10" processor expected to power the next-generation iPhone, TSMC will likely gain complete control of Apple's processor manufacturing orders, according to a new report.

The iPhone 7 is going to pack an A10 chip that’s going to be even faster and more energy-efficient than its predecessor. It will also be … ...