Abstract: Low-temperature Cu/Cu direct bonding technology using formic acid vapor in situ treatment was developed. Effect of formic acid vapor treatment conditions on Cu surface and bonding was ...

Nitroso compounds, such as 2-methyl-2-nitrosopropane, nitrosobenzene, and 4-nitrosophenol, were tested as volatile inhibitors for vapor-phase inhibition of acrylic acid polymerization during its ...