GaN is especially well-established in low-power applications like chargers for personal electronics, while silicon and SiC ...

SiC and GaN advances used improved device structures and higher levels of integration to support higher voltages and power ...

Wide bandgap materials and advanced packaging are revolutionizing power, but thermal and integration challenges persist.

Innovations in cool-running packaging technologies and embedded passive networks are enabling power devices to run at higher ...

These four Buy-rated stocks are trading under $10 and could offer patient investors enormous returns for 2025 and beyond.

Ortel, a Photonics Foundries enterprise, today announced the successful transfer of wafer fabrication for its C-Band, ...

Nervous investors may wonder if semiconductor stocks are still a good bet. Wall Street expectations are especially high for ...

Thermal challenges in 5G radios and the combination of passive and active thermal management techniques and hardware design ...

Building on recent achievements at an emission wavelength of 450 nm, Swiss company Exalos has announced narrow-linewidth DFB ...