TSMC's CoWoS-S is a high-end 2.5D packaging technology ... that connect to high-bandwidth memory (HBM). However, based on the Blackwell architecture, Nvidia's B100 and B200 GPUs require two ...
offers high density interconnects and deep trench capacitors over a large silicon interposer area to accommodate components such as logic chipsets and HBM memory. CoWoS-L combines CoWoS-S with ...
The platform supports both the TSMC CoWoS-S (silicon Interposer ... PHY and memory at any angle while keeping the same signal quality as in regular straight HBM bus routing. It also provides a high ...
It allows shorter routing, better signal integrity, higher speed and lower power consumption than traditional zig-zag HBM bus routing ... GUC’s design for CoWoS and interposer supports 112G-LR SerDes ...
TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...
South Korean memory makers SK Hynix and Samsung Electronics both saw their exports of multi-chip packages (MCP) fall ...
Micron Technology, the Fortune 500 memory chipmaker, is breaking ground on a new high-bandwidth memory (HBM) packaging facility in Singapore. The company expects operations to begin next year with ...
High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...
TSMC maintains CoWoS equipment orders despite Nvidia demand ... with TSMC due to challenges in process technology and HBM production. Regarding whether Samsung has placed orders with TSMC, TSMC ...
As Nvidia ramps up production of its multi-chiplet Blackwell-series products, the company will use more CoWoS-L packaging capacity and less CoWoS-S packaging capacity, the company's chief ...
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