It has now added the capability to easily edit photos and even change image background on the Gemini app, directly on your mobile. With new AI image editing capabilities on the Gemini app ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality ...

Cost of semiconductor chip manufacturing has increased drastically over the years for several reasons. Now, President Donald Trump recently vowed to impose sector-specific tariffs on chips.

Santa Clara, CA and Kyoto, Japan, Jan. 22, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced a new 32-bit D/A converter IC (DAC chip[1]) and evaluation board designed for flagship models ...

Samsung re-designing its HBM chips, IBM and Global foundries settling their dispute, and TI’s in-cabin radar IC for vehicles… Let’s take them in reverse order: 5. Cambridge EV fast-charge battery ...

KUMAMOTO, Japan/TOKYO -- With more than 20 billion image sensors shipped to date and a new plant being constructed in Japan's Kumamoto prefecture -- home to a growing chip industry cluster -- Sony ...

Background removal options have often been hit or miss, but Aiarty Image Matting makes the process simple with powerful AI edge detection. Whether you're crafting ad campaigns, designing custom ...

Taiwan's TSMC, by far the world's largest and most technologically advanced IC foundry, is rapidly expanding its Chip-on-Wafer-on-Substrate (CoWoS) packaging capacity. This will eliminate a ...

The DAC Exhibitor Forum sessions, sponsored by Ansys, every day from 1:45 pm to 3:00 pm, have featured significant work in 3D-IC chip analysis and visualization. Monday 6/24: “Understanding Ansys ...

Taiwan's IC design houses are gearing up to prepare new AI-related chip products for the second half of the year, in response to positive feedback from both enterprise and consumer markets in AI ...