In this study, the recent advances and trends of Cu-Cu hybrid bonding (HB) will be investigated. Emphasis is placed on the design, materials, process, fabrications, reliability, challenges ...

Hybrid bonding is an emerging technology for advanced packaging and heterogeneous integration. In this work, Cu/polymer-based hybrid bonding is being evaluated using two types of polymer materials ...

The India-Middle East-Europe Economic Corridor (IMEC) is emerging as one of the most expansive connectivity projects of the modern era. Designed to establish a seamless transport and trade route from ...

Khare also revealed that IBM expects to develop sub-1nm semiconductors in the coming years, and it is possible that Rapidus could serve as the manufacturing partner for these chips in the future. TSMC ...

According to the Israeli government, the MOU will “advance cooperation” in harnessing AI to strengthen Israeli and American energy grids. The MOU also pledges joint efforts in research and innovation, ...

IBM is seeking a long-term partnership with Japan's Rapidus to develop sub-1nm chips, according to . Building on their 2nm collaboration, IBM has deployed engineers to Rapidus's Hokkaido site ...

Eyeo, a spinoff from imec, presents a new image sensor architecture that it claims eliminates the need for traditional color filters, thereby optimizing sensitivity without increasing sensor size. As ...