Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

Modern package and interposer design has become a system integration task: designers have the responsibility to take input from various stake-holders – who are often designing their content at the ...

Power Integrations reported a two-fold increase in power output from the HiperLCS-2 chipset. Featuring advanced half-bridge switch technology and an innovative package, the new device can deliver up ...

Featuring a SiC primary power switch, this 1,700-V flyback switcher IC is now available in low-creepage, automotive-grade packaging that meets the IEC60664-1 isolation standard. Power Integrations ...

Toshiba's new gate driver IC for brushed DC motors supports downsizing, low power use, and higher reliability in automotive ...

The new IC increases continuous power to more than 1.6 kW and permits brief peak loads of 2.5 kW by leveraging a new, thermally efficient POWeDIP™ package. This package includes an electrically ...

remote control applications in consumer products with the new Cyllene 2 IC. Offered in the 2 mm by 2 mm by 0.76 mm QFN package, the enhanced solutions provide drop-in, plug and play replacements for ...

The IC supplies the flexibility to function as either a single-channel H-bridge or two half-bridge channels gate driver. When paired with an external MOSFET, it can replace mechanical relays, ...

Eligible Singaporeans will receive the first payment of $400 to $1,000 this month, which will be automatically credited to ...

Toshiba Electronic Devices & Storage Corporation ("Toshiba") has started mass production of "TB9103FTG," a gate driver ...

This new design allows for improved thermal management by offloading power dissipation to the external PMOS transistors ...

Power device makers roll out their latest advances at APEC 2025, targeting a range of applications from AI data centers to ...