During its annual business briefing earlier today, Perodua has confirmed that it will be launching at least two new cars 2025 ...
New Perodua Bezza render by Theophilus Chin Amid the flurry of news coming out today, Perodua has confirmed that a full model change (FMC) is expected this year. This comes as the national carmaker ...
In addition to Perodua’s upcoming full-model change for the Bezza or the Myvi this year, the national carmaker will also be ...
the Perodua Myvi has seen continuous enhancements since its introduction in 2005. The third-generation Myvi sees safety features such as six airbags, hill start assist, and advanced safety assist ...
Sen. James Lankford, R-Okla., joined 'America's Newsroom' to discuss Republicans' meeting with President Trump and Vice President Vance and how they will advance the America-first agenda.
Perodua and Universiti Teknologi Malaysia (UTM) have signed a memorandum of understanding (MoU) to advance the development of Malaysia’s next generation of electric vehicles (xEV). This partnership ...
In a move that could see a significant shift in Malaysia’s automotive landscape, Perodua has announced a strategic partnership with Universiti Teknologi Malaysia (UTM) to spearhead the development of ...
Advance Auto Parts is making good on their promise to close down hundreds of their locations and descale the business. According to the website Chain Store Age, the chain announced that they have ...
Dave, a cash advance app that allows users to borrow money from their next paycheck, comes with an eye-catching claim they can "g et up to $500 in five minutes." "Like David slaying Goliath ...
Advanced technology holds the key to pulling more people into electric vehicles, enticing drivers to vehicles that integrate into their lives in a way that internal combustion engined cars aren ...
From an expansive context window that gives Gemini Advanced longer-term memory than its competitor to its seamless integration with Google Workspace, access to NotebookLM Plus, and other perks ...
"This project is part of a larger pathfinding mission at imec to advance III-V integration processes towards higher technological readiness, from flip-chip and transfer-printing hybrid techniques in ...