There are a variety of failure analysis and problem-solving methods used to analyze equipment and process failures. The different methods are described and compared so maintenance and reliability ...

Thermocompression bonding (TCB) is an important process in electronic packaging and is widely seen as a promising technology for miniaturized electronic devices. However, this process usually yields a ...

The coverage problem is a crucial issue in wireless sensor networks (WSN), where a high coverage rate ensures a high quality of service of the WSN. This paper proposes a new algorithm to optimize ...

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Crystallization of 204 kg of final active pharmaceutical ingredient was accomplished continuously using a cascade of mixed suspension mixed product removal crystallizers in cGMP manufacturing. This ...

Diagram: This is the diagram of the HTCC-AB02 connected to the BME280 sensor. Diagram was built using Fritzing software: ...

Developed a microcontroller-based automatic room light system using Arduino Uno and infrared sensors. The system counts entries/exits to control lights intelligently. Built with Embedded C, it ...