This article takes a deep dive into the architecture of Arm’s real-time Cortex-R5 MCU and its relevance for the automotive ...

Learn how to build an AI cluster with 5 Mac Studios. Unified memory, performance testing, and networking challenges explained ...

Building a gaming rig with a ₹95,000 budget means you can afford a few extra luxuries without sacrificing performance.

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

How the RISC-V architecture’s inherent traits align with the demands of functional safety standards like ISO 26262.

This hybrid creation stacks up a whopping 16 layers of SanDisk's latest 3D NAND dies using tiny data pipelines called through-silicon vias. There's also a special ...

EnCharge AI’s first-of-its-kind chip takes an analog approach to a key bottleneck in AI computation. A young DARPA-backed startup with a fresh spin on a low-power computer chip has raised over $100 ...

Hollyland has officially announced its new Cosmo C2 Wireless Video System which was first shown as a prototype at IBC 2024 in Amstaerdam.

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Advantest has introduced the T5801 Ultra-High-Speed DRAM Test System. The cutting-edge platform is engineered to support the ...

Enhanced Performance: Integrating compression with CXL allows for efficient data movement, reducing system latency and power consumption. This is particularly beneficial for AI and machine learning ...