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Tom's Hardware on MSN4d
3D X-DRAM aims for 10x capacity of today's memory — NEO Semiconductor's memory has up to 512 Gb per moduleNEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM ...
NEO Semiconductor, a leading developer of innovative technologies for 3D NAND flash memory and 3D DRAM, announced today the ...
Semiconductors are the fundamental building blocks of almost all modern electronics, powering everything from smartphones and ...
A new technical paper titled “Computing with Printed and Flexible Electronics” was published by researchers at Karlsruhe ...
Siemens Digital Industries Software has announced that it has deepened its longstanding collaboration with TSMC to drive ...
Global semiconductor materials market revenue increased 3.8% to $67.5 billion in 2024, SEMI, the global industry association ...
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China’s chipmakers are catching up to Nvidia and TSMC. Here’s how they compareRestrictions on U.S. chips have pushed the Chinese government to invest billions into its domestic supply chain.
Researchers have identified a new material which could be used as a flexible semiconductor in wearable devices by using a technique that focuses on the manipulation of spaces between atoms in crystals ...
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