PCIe Gen 4.0 PHY IP is available in TSMC 28nm HPC/HPC+ process. * A limited number of Test Chips manufactured in TSMC 28HPC (Single lane and Quad Lanes) are available for Early customers. Contact us ...
USB 3.1 PHY IP is available in TSMC 55nm LP process. * A limited number of Test Chips manufactured in TSMC 55LP (Single lane and Quad Lanes) are available for Early customers. Contact us for more ...
Silicon offers the optimal single-junction bandgap ... in a solvent that evaporates during the photovoltaic manufacturing process, offer particular promise with respect to cost per area.
A fire-retardant polyelectrolyte complex coating has been applied to cotton in a single step, an advance that could reduce ... and scaled using the common pad-dry coating process, which is suitable ...