Chuck was also the moderator for the opening plenary session Chiplets: Where We Are Today. The speakers were Jim Handy of ...

As Samsung Electronics gears up to release its fourth-quarter 2024 financial results, industry observers are closely monitoring the company's progress in meeting its high bandwidth memory (HBM ...

Micron specializes in DRAM, NAND, and emerging memory technologies such as High Bandwidth (NASDAQ:BAND) Memory (HBM). The company has recently demonstrated resilience in a challenging market ...

TSMC is planning to build two new CoWoS facilities at the Phase III site of Southern Taiwan Science Park (STSP), in an investment worth in excess of NTD 200 billion. According to a report from the ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

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Specifically, Nvidia is transitioning from CoWoS-S to CoWoS-L, representing a significant advancement in its chip architecture as well as a major shift for TSMC. Speaking on the sidelines of an ...

Nvidia has so far relied mainly on one type of CoWoS technology, CoWoS-S, to combine its AI chips. Nvidia's demand for advanced packaging from TSMC remains strong though the kind of technology it ...

Blackwell, Nvidia's latest artificial intelligence chip, utilizes chip-on-a-wafer substrate, or CoWoS, advanced packaging. An analysis issued yesterday by Ming-Chi Kuo with TF International ...

TL;DR: NVIDIA is shifting from CoWoS-S to CoWoS-L advanced packaging for its Blackwell AI GPUs, requiring increased capacity from TSMC, the leader in semiconductor technology. This transition aims ...