Extreme ultraviolet (EUV) lithography is at the center of next-generation semiconductor manufacturing as it enables smaller ...

High-NA EUV makes progress toward high-volume manufacturing while optical lithography sees continued advances.

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China invests billions to create its own machines, while Canon bets on innovation to threaten Asml dominion in the global market In a quiet Dutch city named Eindhoven, is the headquarters of ASML, ...

By way of example, TSMC's N3E node as used in the latest Apple chips has gate pitch of at minimum 45 nm and a metal pitch of ...

“The SHARP project aims to lead to new manufacturing technologies that enable large-area mirrors with novel properties,” said Dr. Yakup Gönüllü from Schott. He is coordinating the new joint project, ...

Key Laboratory of Photochemical Conversion and Optoelectronic Materials, Technical Institute of Physics and Chemistry, University of Chinese Academy of Sciences, Chinese Academy of Sciences, Beijing ...

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EUV equipment shines lasers onto materials like tin, that then plasmacize, emitting the right kind of light, which is then focused with lenses and mirrors and directed onto the silicon wafers.

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During the last quarter, Intel kept up a steady pace with the manufacture of 30,000 wafers.ts most recent high-NA EUV machines nearly match the performance of earlier EUV systems, yet they deliver ...

According to the official press release Micron Technology announced the shipment of samples of its 1γ, sixth-generation (10nm-class) DRAM-based DDR5 memory to ecosystem partners and select customers.