Master Bond EP29LPSPND-3 is a two component, non-drip epoxy compound with a paste consistency that can be used for bonding and sealing applications. The system is electrically non-conductive and ...

This next-generation adhesive promises to revolutionize material bonding by offering unprecedented impact strength—22 times higher than traditional epoxy-based adhesives that do not incorporate ...

A new study published in Engineering presents a significant advancement in dry adhesive technology. Researchers from Xi'an Jiaotong University ...

For demanding applications where highly flexible, impact-resistant bonds are required, Master Bond has developed Polymer System EP37-3FLF. This optically clear, two-component epoxy has exceptional ...

BANGALORE, India, April 11, 2025 /PRNewswire/ -- Hybrid Bonding Technology Market is Segmented by Type (Wafer-to-wafer Hybrid Bonding, Die-to-wafer Hybrid Bonding), by Application (CMOS Image ...