[Lorentio Brodeso]’s ‘LACED’ project offers one such method, using both chemical etching ... the top image) back in 2016, alongside the detailed setup video of how a multi-layer PCB was ...

Abstract: This paper reports research performed on developing and optimizing a process recipe for the plasma etching of deep high-aspect ratio features into fused silica (fused quartz) material using ...

The team’s breakthrough involves the combination of in-situ passivation and the addition of re-grown heavily doped n-type contacts using a selective etching ... contrast, images for a control device ...

Abstract: Bosch process is widely used in the fabrication of through silicon via (TSV) holes for 3-D integrated circuit and 3-D Packaging applications mainly due to its high silicon etch rate and ...

Through this process, LACED achieves precision ... and basic chemical etching — all performed in a home environment. Successfully exposed internal copper layers of a 6-layer PCB, proving that ...