"This model is a first-draft model of the entorhinal-hippocampal episodic memory circuit. It's a foundation to build on to understand the nature of episodic memory. That's the thing I'm really ...

The oversupply of NAND flash has forced memory chipmakers to implement production cuts in response to lower-than-expected orders from PC and smartphone manufacturers. Major players in ...

3D NAND flash memory is different from traditional single-layer NAND because it vertically stacks memory cells to cram more storage into smaller spaces. The process involves carving precise ...

Block Diagram of the Next Generation Flash device enabling small size, low power and direct connection with digital circuit which opens up new possibiities ...

SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...

Yangtze Memory Technologies Corporation (YMTC), China’s leading flash memory chip manufacturer ... according to a recent report from Canadian integrated circuit (IC) research firm TechInsights.