Ansys  today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These certifications help ensure functionality and reliability ...

JCET Group (SSE: 600584), a leading global provider of integrated circuit (IC) back-end manufacturing and technology services, today announced its financial results for the first quarter of 2025. The ...

It also provides digital IC design and sign off products, including Genus synthesis and Joules RTL power solutions, as well as Modus DFT software solution to reduce systems-on-chip design-for-test ...

Nano Labs Ltd operates as a fabless integrated circuit design company and product solution provider in the People’s Republic of China and internationally. It develops computing chips.

In the annals of golf, few names resonate as profoundly as Jack Nicklaus, Tiger Woods, Arnold Palmer, and Ben Hogan. These ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity™ 3D-IC Platform now features enhanced support for improved ...

Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN ...

In addition, Cadence’s HBM4 test chip is pre-silicon-ready for tapeout, which is paving the way for CoWoS-L. The Cadence Integrity ™ 3D-IC Platform now features enhanced support for improved quality ...

Cadence and TSMC Advance AI and 3D-IC Chip Design with Certified Design Solutions for TSMC’s A16 and N2P Process Technologies Also announce tool certification for TSMC N3C process and initial ...

More specifically, we’re talking about the powerful Dimensity 9400 chip. It could also be the Dimensity 9400+, a slightly overclocked variant of the SoC. For now, this is all we know about the ...

Supreme Electronics, a Taiwan-based IC distributor, is seeing a significant uptick in customer demand and price levels as US tariff policies prompt inventory stockpiling across global markets ...