Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging ...

While the iPhone 17 series is still three months away from launching, rumors about next year's iPhone 18 models continue to ...

According to Apple news and rumors guru Mark Gurman at Bloomberg, Apple will release a new M5 MacBook Pro in the fall of 2025 ...

TSMC's dominance in advanced nodes and AI packaging positions it as an irreplaceable infrastructure in the global ...

US fab nears full capacity, 2nm yields soar, and chip prices may spike Nvidia’s next wave of AI chips is heading for mass ...

TSMC is set to begin mass production of its 2nm process node, marking a new era in semiconductor manufacturing, according to ...

TSMC is expected to charge $45,000 for 1.4nm silicon wafers in 2028, up 50% from the $30K it charges for 2nm wafers.

The Commercial Times reports that TSMC's upcoming N2 2nm semiconductors will cost $30,000 per wafer, a roughly 66% increase ...

Computex 2025 has been the home to some of the most interesting tech, and BW Businessworld was on the ground to cover it.

Xiaomi Chairman Lei Jun unveiled the company's debut in-house mobile SoC, the XRing O1, on May 22, calling it Xiaomi's "first answer sheet" in semiconductor design. Built on TSMC's second-generation ...

Samsung Foundry has boosted utilization with fresh 7nm and 8nm chip orders from Nintendo and multiple AI chipmakers. Yet its ...