Infineon Technologies is intensifying its collaboration with suppliers to further reduce CO 2 emissions along the whole ...

The HybridPACK Drive G2 Fusion is the first plug'n'play power module that implements a combination of Infineon’s silicon and ...

SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, has announced the ...

UC Santa Barbara researchers have achieved the first-ever “movie” of electric charges traveling across the interface of two ...

The electronic design automation (EDA) industry reported substantial revenue growth in Q2 2024,” said Walden C. Rhines, ...

Nova says that one of the world's leading logic manufacturers recently qualified Nova Prism 2 to address backside power ...

Heidelberg Instruments has launched its new NanoFrazor nanolithography system, advancing decades of expertise in micro- and ...

Mitsubishi Electric's Power Device Works' Fukuyama Factory has begun large-scale supply of power semiconductor chips made ...

Validation of Plurilock’s strategy of winning large, high-value customers and expanding those relationships by delivering consistent, high-quality services and solutions. Plurilock Security has ...

Scholarship applications for the 2025 - 2026 academic year can be submitted immediately. The closing deadline is October 25.

The partnership with IPro Silicon IP Ltd. will allow Baya Systems to scale its groundbreaking technology across new global markets. IPro, a leading supplier of custom processors, security solutions, ...

Expanded network-on-chip tiling supported by mesh topology capabilities in FlexNoC and Ncore interconnect IP products allow systems-on-chip with AI to easily scale by more than 10 times without ...