
TI to open 300mm wafer bumping facility in Chengdu, China
Nov 5, 2014 · The addition of this manufacturing process in Chengdu further increases TI's 300mm analog capacity and its ability to support customer demand. TI announced the new …
Texas Instruments opens the company's first semiconductor manufacturing ...
CHENGDU, China, Oct. 14 /PRNewswire-FirstCall/ -- Texas Instruments Incorporated (NYSE: TXN) (TI) today announced its first wafer fabrication facility, or "fab," in China. This important...
TI 公司信息 - 中国区联系信息 - 德州仪器 TI.com.cn
Texas Instruments Semiconductor Technologies (Shanghai) Co., Ltd. 德州仪器半导体技术(上海)有限公司. Shanghai Branch 上海分公司 32/F China Fortune Tower, 1568 Century Avenue …
成都一体化制造基地,助力芯成长 | TI.com.cn
6 days ago · TI成都是我们公司全球唯一的一体化制造基地,能够从事晶圆到芯片生产的全工艺流程。 从2010年成立以来,TI成都一直在为中国和全球的客户提供支持、为他们提供在成都本 …
Texas Instruments acquires UTAC facility in Chengdu, China
Dec 19, 2013 · The new 358,000 square-foot facility will become TI's seventh assembly/test (A/T) operation. Located on the same property as TI's existing wafer fab in Chengdu, the site will …
TI buys former SMIC fab in Chengdu - EE Times
Oct 15, 2010 · SAN FRANCISCO—Texas Instruments Inc. Thursday (Oct. 14) announced its first wafer fab in China, a fully-equipped 200-mm facility in the Chengdu High-tech Zone that TI …
Texas Instruments: Stronger Local Support for Customers
Feb 18, 2025 · TI's Chengdu manufacturing base packaging/testing plant expansion project is about to be put into operation, and the Shanghai product distribution center has completed …
TI will now further extend its operations in Chengdu with a 300mm wafer bumping facility on its Chengdu High-tech Zone (CDHT) campus.
Texas Instruments Semiconductor Manufacturing (Chengdu) Co…
Find company research, competitor information, contact details & financial data for Texas Instruments Semiconductor Manufacturing (Chengdu) Co., Ltd. of Chengdu, Sichuan. Get the …
TI to Open 300mm Wafer Bumping Facility in Chengdu, China
Nov 6, 2014 · Texas Instruments Incorporated (TI) today announced it will expand its manufacturing capacity in Chengdu, China, with a 300mm wafer bumping facility. The addition …
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