The need for more input/output (I/O) connections was a big driver in package evolution. Think about it: a chip with a million ...

It doesn’t include specialized packages, high-power packages, or packages with higher pin counts. The plastic ball-grid-array (PBGA) package can have up to 976 connections! 2.

The motherboard receptacle for Pentium II and III CPUs. Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the ...

The processors are based on a new microarchitecture and they move away from PGA (pin grid array) package designs in favor of LGA (land grid array).

Further, the pin grid arrays segment dominated the global System in Package (SiP) Technology Market, by interconnection technique, in 2019.

AMD has long stuck with a pin grid array (PGA) for its CPU packaging. You could go all the way back to the original Athlon processors and find a chip package not all that different from today's 16 ...

A Ball Grid Array is descended from the pin grid array (PGA): a historic VLSI through-hole packaging technology, featuring a regular array of metal pins underneath the package on a not very ...

A Pin Grid Array (PGA) is a form of packaging with through-hole mounting. It is a nailbrush-shaped container with arranged lead pins positioned vertically on the bottom of the package.

Expanding application of ball grid array packages in the automotive and industrial sectors is likely to offer remunerative opportunities to the market.