Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the more elaborate Single Edge Cartridge (SEC) and Slot 1 ...

The Ball Grid Array, or BGA package is no longer the ... The ATI VGA controller on the left has a 208 pin QFP package with a 0.5 mm pin pitch. The Ali M1531 system controller, on the right ...

A package containing leads organized in a grid pattern on one side. There are two varieties: PGA types with through-hole mounting and BGA types with surface mounting. A Pin Grid Array (PGA) is a form ...

AMD has long stuck with a pin grid array (PGA) for its CPU packaging. You could go all the way back to the original Athlon processors and find a chip package not all that different from today's 16 ...

A Ball Grid Array is descended from the pin grid array (PGA): a historic VLSI through-hole packaging technology, featuring a regular array of metal pins underneath the package on a not very ...

and flip chip pin grid array (FCPGA) packaging. As the next generation devices’ requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A ...