Socket 370 accepts a 370-pin PPGA (plastic pin grid array) chip package. Socket 370 chips and motherboards cost less to manufacture than the more elaborate Single Edge Cartridge (SEC) and Slot 1 ...

AMD has long stuck with a pin grid array (PGA) for its CPU packaging. You could go all the way back to the original Athlon processors and find a chip package not all that different from today's 16 ...

The processors are based on a new microarchitecture and they move away from PGA (pin grid array) package designs in favor of LGA (land grid array). New chipsets also are arriving alongside the ...

A Ball Grid Array is descended from the pin grid array (PGA): a historic VLSI through-hole packaging technology, featuring a regular array of metal pins underneath the package on a not very ...

Further, the pin grid arrays segment dominated the global System in Package (SiP) Technology Market, by interconnection technique, in 2019. Among the key end-user industries, the consumer ...

A package containing leads organized in a grid pattern on one side. There are two varieties: PGA types with through-hole mounting and BGA types with surface mounting. A Pin Grid Array (PGA) is a form ...

and flip chip pin grid array (FCPGA) packaging. As the next generation devices’ requirements for power get even higher, enhanced thermal performance at the package level is increasingly important. A ...

"The Flip Chip Pin Grid Array (FC-PGA) package is used on Pentium III processors, while Plastic Pin Grid Array (PPGA) packaging is used in Celerons," begins McMillan. He points out that this does ...

Unisem is also pleased to announce the addition of the Lead Frame Grid Array (LFGA, also called HDL developed by QPL), to its comprehensive set of package offerings. The LFGA is a leadframe based ...

Expanding application of ball grid array packages in the automotive and industrial ... It is used in the automotive sector for high-pin-count equipment as well as in combination with Flip chip ...